The solder bump pads have to be coated with ________________
which provides an adhesion layer.
(A) Under Bump Metallurgy (B) Solder Pads
(C) Adhesive (D) Heat
Ans: A
which provides an adhesion layer.
(A) Under Bump Metallurgy (B) Solder Pads
(C) Adhesive (D) Heat
Ans: A
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